Led display technology rapid development, the point distance is more and more small, led encapsulation from 3528, 2020, 1515, 1010, 0505, in order to satisfy the demands of high density to a smaller size.
Led packaging of 1515, 2020, 3528, light body, pin shape using J or L encapsulation way, the star of 1010 and 0505 adopt QFN packages. Traditional display is on one side of the PCB SMT drive IC, other side mount the lamp body, lamp luminous body through constant current chip driver. Constant current chip layout is reasonable directly influence the screen display effect, thermal effect produced by the led light-emitting characteristics, normal, in turn, affects the whole screen color uniformity. Led lamp body size miniaturization will lead to the difficult SMT SMT process and repair. High density display pixel pitch is more and more small, constant current output chip foot will increase, bad cooling will cause uneven screen body heat, affecting the service life of display uniformity and highlight become urgently needs to solve the problem of heat dissipation problem.

A new type of encapsulation method can effectively solve the problem of heat dissipation, SMT, and can promote the reliability of the product, very high density of pixels to be led array. New packaging is a new type based on BGA, CSP leds encapsulation. Chip and led constant current drive logic wafer packaging together, structure mainly include seven parts: epoxy body, IC chip, wafer, support body, interconnection layer and solder ball (or bumps, welding column), the protective layer. Interconnection layer through the load with automatic welding (TAB), wire bonding (WB), flip chip (FC), and other ways to implement the chip with solder ball (or bumps, welding column), the internal connection between part isthe key to the packaging.

Led life is closely related to heat dissipation, high temperature for long run will accelerate the attenuation, reduce the service life. Using heat solder ball (thermal ball) and the cooling channel (thermal via) to assist cooling, the best way to increase the heat dissipation is the use of cooling with tin ball, cooling installed directly in the tin ball refers to chip directly under the base board of tin ball, tin can borrow the ball directly upload heat on PCB, and to reduce the thermal resistance of the air. In order to make the heat to the ball more quickly, can use cooling channels through the substrate.
Led the new packaging is the product of IC with lights, modular, assembly easier, more efficient, play an important role for the promotion of small spacing led display.

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