LED energy saving, environmental protection, long life, small volume, etc., can be widely used in all kinds of instructions, display, adornment, back light, general lighting and urban night scene, etc. In recent years, some economic developed countries in the world there was intense competition around LED the development of the technology competition.
Application of LED light source the light rate decisions
LED structure has a key role to play its features, modern LED lamps and lanterns is mainly composed of the LED light source, optical system, drive unit, radiator, such as standard interface of lamps and lanterns of five parts.

Germany amount a chip through mixed with nano phosphor in the silica gel can make the refractive index increased

 to 1.8 above, to reduce the light scattering, enhances LED the luminous efficiency and effectively improve the quality of light color. Usually phosphor powder size on more than 1 um refractive index is greater than or equal to 1.85, and silica gel refractive index of 1.5 or so commonly, because both with refractive index mismatch and phosphor particle size big light scattering limit (30 nm), thus phosphor powder particle surface light scattering, reduces the rate of light.

The white LED mainly by three forms:
1, using red, green and blue leds glow combination is more white LED chips;
Phosphors, the blue LED chip and $2, by the blue and yellow light are two complementary color white or with blue LED chip with red and green phosphor powder, made by the chip of the blue light, red light and green light from the phosphor three color mixing to obtain white light;
3, using uv LED chip near ultraviolet excitation tricolor phosphors have white light.
Currently widely used is the second way, using blue LED chips and $phosphors, complement each other to get white light. This chip LED the lumen efficiency, therefore, depends on the initial luminous flux and retention light blue chips.
And blue LED chip initial luminous flux is along with the extension and substrate technology development and promotion. Optic light to maintain the rate by encapsulating technology to keep, keep the optic retention is the key to improve the conductive and heat dissipation in environment, that has implications for the key technology of LED encapsulation: low thermal resistance package process and high encapsulation structure and get light rate.
For now, the existing level of LED lights, because 80% of the input power is converted into heat, so the chip cooling heat is critical. Thermal resistance mainly include LED encapsulation material internal thermal resistance and the interface thermal resistance. The effect of heat dissipation base mainly absorbs the heat generated by the chip, and conduction to the thermal resistance, realize heat exchange with the outside world; And reduce the contact interface and the interface thermal resistance and enhance the heat dissipation is the key, so the chips and heat dissipation base of thermal interface materials selection is very important, the low temperature eutectic solder paste or silver glue. Germany amount a lighting using LED chip use of thermal conductivity of thermal conductive adhesive was doped nanoparticles within glue, effectively improve the interfacial heat transfer, reduce the interface thermal resistance, accelerated the heat dissipation of the LED chip.
In LED, in use process of radiative recombination photons produce loss when to launch, there are three main aspects:
1, chip internal structure defects and the absorption of the material, the photons in the area of fire surface caused by the difference of refractive index reflecting loss;
2, due to the incident Angle is greater than the total reflection critical Angle of total reflection loss;
3, through the chip surface covering a layer of relatively high refractive index of transparent rubber effectively decrease the loss of the photon in the interface, improve the rate of light.

Therefore requires its has high light transmittance, refractive index, high thermal stability, good liquidity, easy spraying, is to improve the reliability of LED encapsulation it requires low hygroscopicity, low stress and aging resistance and other properties. And usually white LED phosphors need chip blu-ray excitation of $synthesis, within the encapsulation adhesive still need to add $phosphors for color mixture ratio, therefore the excitation efficiency of phosphors and conversion efficiency is the key of high photosynthetic efficiency.

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